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HY5DU323222Q
32M(1Mx32) DDR SDRAM
HY5DU323222Q
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev. 0.5 / Jun. 2005 1
1HY5DU323222Q Revision History
No. 0.1 0.2 0.3 0.4 0.5 Preliminary Data Sheet Release AC parameter change (tDRL, tCK_max, tAC etc.) Insert AC Overshoot/ Undershoot Specification 200Mhz Speed bin insert Editorial change (Page21) : DC Operating condition Insert Pin capacitance (Page28) History Draft Date Remark Jan. 2003 Jan. 2003 Apr. 2003 May. 2004 Jun. 2005
Rev. 0.5 / Jun. 2005
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1HY5DU323222Q
DESCRIPTION
The Hynix HY5DU323222 is a 33,554,432-bit CMOS Double Data Rate(DDR) Synchronous DRAM, ideally suited for the point-to-point applications which requires high bandwidth. The Hynix 1Mx32 DDR SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the clock. While all addresses and control inputs are latched on the rising edges of the CK (falling edges of the /CK), Data, Data strobes and Write data masks inputs are sampled on both rising and falling edges of it. The data paths are internally pipelined and 2-bit prefetched to achieve very high bandwidth. All input and output voltage levels are compatible with SSTL_2.
FEATURES
* * * * * * * VDD, VDDQ = 2.5V 5% All inputs and outputs are compatible with SSTL_2 interface JEDEC standard 20mm x 14mm 100pin LQFP with 0.65mm pin pitch Fully differential clock inputs (CK, /CK) operation Double data rate interface Source synchronous - data transaction aligned to bidirectional data strobe (DQS) Data outputs on DQS edges when read (edged DQ) Data inputs on DQS centers when write (centered DQ) Data(DQ) and Write masks(DM) latched on the both rising and falling edges of the data strobe * * * * * * * * * All addresses and control inputs except Data, Data strobes and Data masks latched on the rising edges of the clock Write mask byte controls by DM (DM0 ~ DM3) Programmable /CAS Latency 3 and 4 supported Programmable Burst Length 2 / 4 / 8 with both sequential and interleave mode Internal 4 bank operations with single pulsed /RAS tRAS Lock-Out function supported Auto refresh and self refresh supported 4096 refresh cycles / 32ms Half strength and Matched Impedance driver option controlled by EMRS
*
ORDERING INFORMATION
Part No. HY5DU323222Q-5 HY5DU323222Q-6 Power Supply Clock Frequency 200MHz 166MHz Max Data Rate 400Mbps/pin 333Mbps/pin interface Package 20mm x 14mm 100pin LQFP
VDD/VDDQ = 2.5V
SSTL_2
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1HY5DU323222Q
PIN CONFIGURATION
VDDQ
VDDQ
VSSQ
VSSQ
DQ31 DQ30
VSSQ 82
DQ1
DQ0
NC
100
96
91
NC
NC
85
99
98
97
95
94
93
92
90
89
88
87
86
84
83
81
DQ29
VDD
DQS
DQ2
VSS
NC
NC
NC
DQ3 VDDQ DQ4 DQ5 VSSQ DQ6 DQ7 VDDQ D Q 16 D Q 17 VSSQ D Q 18 D Q 19 VDDQ VDD VSS D Q 20 D Q 21 VSSQ D Q 22 D Q 23 VDDQ DM0 DM2 /W E /C A S /R A S /C S BA0 BA1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
T O P V IE W
20m m x 14m m 1 0 0 P in Q F P 0 .6 5 m m P itch
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
D Q 28 VDDQ D Q 27 D Q 26 VSSQ D Q 25 D Q 24 VDDQ D Q 15 D Q 14 VSSQ D Q 13 D Q 12 VDDQ VSS VDD D Q 11 D Q 10 VSSQ DQ9 DQ8 VDDQ VREF DM3 DM1 CLK /C L K CKE DSF, M CL A 8 /A P
32
41
45
38
39
40
42
43
44
46
47
48
31
33
34
35
36
37
NC
A9
NC
A4
A6
49
VDD
VSS
NC
NC
NC
NC
NC
NC
A2
A0
A3
ROW and COLUMN ADDRESS TABLE
Items
Organization Row Address Column Address Bank Address Auto Precharge Flag Refresh
NC
1Mx32
256K x 32 x 4banks A0 ~ A9 A0 ~ A7 BA0, BA1 A8 4K
Rev. 0.5 / Jun. 2005
A5
A7
A1
50
4
1HY5DU323222Q
PIN DESCRIPTION
PIN CK, /CK TYPE Input DESCRIPTION Clock: CK and /CK are differential clock inputs. All address and control input signals are sampled on the crossing of the positive edge of CK and negative edge of /CK. Output (read) data is referenced to the crossings of CK and /CK (both directions of crossing). Clock Enable: CKE HIGH activates, and CKE LOW deactivates internal clock signals, and device input buffers and output drivers. Taking CKE LOW provides PRECHARGE POWER DOWN and SELF REFRESH operation (all banks idle), or ACTIVE POWER DOWN (row ACTIVE in any bank). CKE is synchronous for POWER DOWN entry and exit, and for SELF REFRESH entry. CKE is asynchronous for SELF REFRESH exit, and for output disable. CKE must be maintained high throughout READ and WRITE accesses. Input buffers, excluding CK, /CK and CKE are disabled during POWER DOWN. Input buffers, excluding CKE are disabled during SELF REFRESH. CKE is an SSTL_2 input, but will detect an LVCMOS LOW level after Vdd is applied. Chip Select : Enables or disables all inputs except CK, /CK, CKE, DQS and DM. All commands are masked when CS is registered high. CS provides for external bank selection on systems with multiple banks. CS is considered part of the command code. Bank Address Inputs: BA0 and BA1 define to which bank an ACTIVE, Read, Write or PRECHARGE command is being applied. Address Inputs: Provide the row address for ACTIVE commands, and the column address and AUTO PRECHARGE bit for READ/WRITE commands, to select one location out of the memory array in the respective bank. A8 is sampled during a precharge command to determine whether the PRECHARGE applies to one bank (A8 LOW) or all banks (A8 HIGH). If only one bank is to be precharged, the bank is selected by BA0, BA1. The address inputs also provide the op code during a MODE REGISTER SET command. BA0 and BA1 define which mode register is loaded during the MODE REGISTER SET command (MRS or EMRS). Command Inputs: /RAS, /CAS and /WE (along with /CS) define the command being entered. Input Data Mask: DM(0~3) is an input mask signal for write data. Input data is masked when DM is sampled HIGH along with that input data during a WRITE access. DM is sampled on both edges of DQS. Although DM pins are input only, the DM loading matches the DQ and DQS loading. DM0 corresponds to the data on DQ0-Q7; DM1 corresponds to the data on DQ8-Q15; DM2 corresponds to the data on DQ16-Q23; DM3 corresponds to the data on DQ24-Q31. Data Strobe: Output with read data, input with write data. Edge aligned with read data, centered in write data. Used to capture write data. Data input / output pin : Data Bus Power supply for internal circuits and input buffers. Power supply for output buffers for noise immunity. Reference voltage for inputs for SSTL interface. No connection.
CKE
Input
/CS
Input
BA0, BA1
Input
A0 ~ A9
Input
/RAS, /CAS, /WE
Input
DM0 ~ DM3
Input
DQS DQ0 ~ DQ31 VDD/VSS VDDQ/VSSQ VREF NC
I/O I/O Supply Supply Supply NC
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1HY5DU323222Q
FUNCTIONAL BLOCK DIAGRAM
4Banks x 256Kbit x 32 I/O Double Data Rate Synchronous DRAM
Write Data Register 2-bit Prefetch Unit 64 CLK /CLK CKE /CS /RAS /CAS /WE DM (0~3) Bank Control Command Decoder 256Kx32/Bank0 Sense AMP Sense AMP 256 Kx32 /Bank1 256 Kx32 /Bank2 256 Kx32 /Bank3 Mode Register Row Decoder 64
32
Input Buffer Input Buffer
DS
2-bit Prefetch Unit
Output Buffer Output Buffer
32
DQ[0:31]
Column Decoder
A0 ~ A9 BA0, BA1
DQS Address Buffer Column Address Counter CLK_DLL DS Data Strobe Transmitter Data Strobe Receiver
CLK, /CLK
DLL Block
Mode Register
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1HY5DU323222Q
SIMPLIFIED COMMAND TRUTH TABLE
Command CKEn-1 CKEn CS RAS CAS WE
ADDR
A8/ AP
BA
Note
Extended Mode Register Set Mode Register Set Device Deselect No Operation Bank Active Read Read with Autoprecharge Write Write with Autoprecharge Precharge All Banks Precharge selected Bank Read Burst Stop Auto Refresh Entry Self Refresh Exit
H H H H H
X X X X X
L L H L L L
L L X H L H
L L X H H L
L L X H H H CA
OP code OP code X RA L H L H H L X X V V
1,2 1,2 1 1 1 1,3 1 1,4 1,5 1 1 1 1
H
X
L
H
L
L
CA
V X V
H H H H L
X X H L H
L L L L H L H L H L H L
L H L L X H X H X H X V X
H H L L X H X H X H X V
L L H H X H X H X H X V
X
X
1 1
Entry Precharge Power Down Mode Exit
H
L
X
1 1 1 1
L
H
Active Power Down Mode
Entry Exit
H L
L H
X
1 1
( H=Logic High Level, L=Logic Low Level, X=Don't Care, V=Valid Data Input, OP Code=Operand Code, NOP=No Operation )
Note : 1. DM(0~3) states are Don't Care. Refer to below Write Mask Truth Table. 2. OP Code(Operand Code) consists of A0~A9 and BA0~BA1 used for Mode Register setting during Extended MRS or MRS. Before entering Mode Register Set mode, all banks must be in a precharge state and MRS command can be issued after tRP period from Prechagre command. 3. If a Read with Autoprecharge command is detected by memory component in CK(n), then there will be no command presented to activated bank until CK(n+BL/2+tRP). 4. If a Write with Autoprecharge command is detected by memory component in CK(n), then there will be no command presented to activated bank until CK(n+BL/2+1+tDPL+tRP). Last Data-In to Prechage delay(tDPL) which is also called Write Recovery Time (tWR) is needed to guarantee that the last data has been completely written. 5. If A8/AP is High when Precharge command being issued, BA0/BA1 are ignored and all banks are selected to be precharged.
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1HY5DU323222Q
WRITE MASK TRUTH TABLE
Function CKEn-1 CKEn /CS, /RAS, /CAS, /WE DM(0~3)
ADDR
A8/ AP
BA
Note
Data Write Data-In Mask
H H
X X
X X
L H
X X
1,2 1,2
Note : 1. Write Mask command masks burst write data with reference to DQS(Data Strobes) and it is not related with read data. 2. DM0 corresponds to the data on DQ0-Q7; DM1 corresponds to the data on DQ8-Q15; DM2 corresponds to the data on DQ16-Q23; DM3 corresponds to the data on DQ24-Q31.
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1HY5DU323222Q
OPERATION COMMAND TRUTH TABLE - I
Current State /CS /RAS /CAS /WE Address Command Action
H L L L IDLE L L L L L H L L L ROW ACTIVE L L L L L H L L L READ L L L L L H L WRITE L L L
X H H H H L L L L X H H H H L L L L X H H H H L L L L X H H H H
X H H L L H H L L X H H L L H H L L X H H L L H H L L X H H L L
X H L H L H L H L X H L H L H L H L X H L H L H L H L X H L H L
X X X BA, CA, AP BA, CA, AP BA, RA BA, AP X OPCODE X X X BA, CA, AP BA, CA, AP BA, RA BA, AP X OPCODE X X X BA, CA, AP BA, CA, AP BA, RA BA, AP X OPCODE X X X BA, CA, AP BA, CA, AP
DSEL NOP BST READ/READAP WRITE/WRITEAP ACT PRE/PALL AREF/SREF MRS DSEL NOP BST READ/READAP WRITE/WRITEAP ACT PRE/PALL AREF/SREF MRS DSEL NOP BST READ/READAP WRITE/WRITEAP ACT PRE/PALL AREF/SREF MRS DSEL NOP BST READ/READAP WRITE/WRITEAP
NOP or power down3 NOP or power down3 ILLEGAL4 ILLEGAL4 ILLEGAL4 Row Activation NOP Auto Refresh or Self Refresh5 Mode Register Set NOP NOP ILLEGAL4 Begin read : optional AP6 Begin write : optional AP6 ILLEGAL4 Precharge7 ILLEGAL11 ILLEGAL11 Continue burst to end Continue burst to end Terminate burst Term burst, new read:optional AP8 ILLEGAL ILLEGAL4 Term burst, precharge ILLEGAL11 ILLEGAL11 Continue burst to end Continue burst to end ILLEGAL4 Term burst, new read:optional AP8 Term burst, new write:optional AP
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1HY5DU323222Q
OPERATION COMMAND TRUTH TABLE - II
Current State /CS /RAS /CAS /WE Address Command Action
L WRITE L L L H L L READ WITH AUTOPRECHARGE L L L L L L H L L WRITE AUTOPRECHARGE L L L L L L H L L L PRECHARGE L L L L L
L L L L X H H H H L L L L X H H H H L L L L X H H H H L L L L
H H L L X H H L L H H L L X H H L L H H L L X H H L L H H L L
H L H L X H L H L H L H L X H L H L H L H L X H L H L H L H L
BA, RA BA, AP X OPCODE X X X BA, CA, AP BA, CA, AP BA, RA BA, AP X OPCODE X X X BA, CA, AP BA, CA, AP BA, RA BA, AP X OPCODE X X X BA, CA, AP BA, CA, AP BA, RA BA, AP X OPCODE
ACT PRE/PALL AREF/SREF MRS DSEL NOP BST READ/READAP WRITE/WRITEAP ACT PRE/PALL AREF/SREF MRS DSEL NOP BST READ/READAP WRITE/WRITEAP ACT PRE/PALL AREF/SREF MRS DSEL NOP BST READ/READAP WRITE/WRITEAP ACT PRE/PALL AREF/SREF MRS
ILLEGAL4 Term burst, precharge ILLEGAL11 ILLEGAL11 Continue burst to end Continue burst to end ILLEGAL ILLEGAL10 ILLEGAL10 ILLEGAL4,10 ILLEGAL4,10 ILLEGAL11 ILLEGAL11 Continue burst to end Continue burst to end ILLEGAL ILLEGAL10 ILLEGAL10 ILLEGAL4,10 ILLEGAL4,10 ILLEGAL11 ILLEGAL11 NOP-Enter IDLE after tRP NOP-Enter IDLE after tRP ILLEGAL4 ILLEGAL4,10 ILLEGAL4,10 ILLEGAL4,10 NOP-Enter IDLE after tRP ILLEGAL11 ILLEGAL11
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1HY5DU323222Q
OPERATION COMMAND TRUTH TABLE - III
Current State /CS /RAS /CAS /WE Address Command Action
H L L L ROW ACTIVATING L L L L L H L L L WRITE RECOVERING L L L L L H L L WRITE RECOVERING WITH AUTOPRECHARGE L L L L L L H L REFRESHING L L
X H H H H L L L L X H H H H L L L L X H H H H L L L L X H H H
X H H L L H H L L X H H L L H H L L X H H L L H H L L X H H L
X H L H L H L H L X H L H L H L H L X H L H L H L H L X H L H
X X X BA, CA, AP BA, CA, AP BA, RA BA, AP X OPCODE X X X BA, CA, AP BA, CA, AP BA, RA BA, AP X OPCODE X X X BA, CA, AP BA, CA, AP BA, RA BA, AP X OPCODE X X X BA, CA, AP
DSEL NOP BST READ/READAP WRITE/WRITEAP ACT PRE/PALL AREF/SREF MRS DSEL NOP BST READ/READAP WRITE/WRITEAP ACT PRE/PALL AREF/SREF MRS DSEL NOP BST READ/READAP WRITE/WRITEAP ACT PRE/PALL AREF/SREF MRS DSEL NOP BST READ/READAP
NOP - Enter ROW ACT after tRCD NOP - Enter ROW ACT after tRCD ILLEGAL4 ILLEGAL4,10 ILLEGAL4,10 ILLEGAL4,9,10 ILLEGAL4,10 ILLEGAL11 ILLEGAL11 NOP - Enter ROW ACT after tWR NOP - Enter ROW ACT after tWR ILLEGAL4 ILLEGAL ILLEGAL ILLEGAL4,10 ILLEGAL4,11 ILLEGAL11 ILLEGAL11 NOP - Enter precharge after tDPL NOP - Enter precharge after tDPL ILLEGAL4 ILLEGAL4,8,10 ILLEGAL4,10 ILLEGAL4,10 ILLEGAL4,11 ILLEGAL11 ILLEGAL11 NOP - Enter IDLE after tRC NOP - Enter IDLE after tRC ILLEGAL11 ILLEGAL11
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1HY5DU323222Q
OPERATION COMMAND TRUTH TABLE - IV
Current State /CS /RAS /CAS /WE Address Command Action
L L WRITE L L L H L L L MODE REGISTER ACCESSING L L L L L
H L L L L X H H H H L L L L
L H H L L X H H L L H H L L
L H L H L X H L H L H L H L
BA, CA, AP BA, RA BA, AP X OPCODE X X X BA, CA, AP BA, CA, AP BA, RA BA, AP X OPCODE
WRITE/WRITEAP ACT PRE/PALL AREF/SREF MRS DSEL NOP BST READ/READAP WRITE/WRITEAP ACT PRE/PALL AREF/SREF MRS
ILLEGAL11 ILLEGAL11 ILLEGAL11 ILLEGAL11 ILLEGAL11 NOP - Enter IDLE after tMRD NOP - Enter IDLE after tMRD ILLEGAL11 ILLEGAL11 ILLEGAL11 ILLEGAL11 ILLEGAL11 ILLEGAL11 ILLEGAL11
Note : 1. H - Logic High Level, L - Logic Low Level, X - Don't Care, V - Valid Data Input, BA - Bank Address, AP - AutoPrecharge Address, CA - Column Address, RA - Row Address, NOP - NO Operation. 2. All entries assume that CKE was active(high level) during the preceding clock cycle. 3. If both banks are idle and CKE is inactive(low level), then in power down mode. 4. Illegal to bank in specified state. Function may be legal in the bank indicated by Bank Address(BA) depending on the state of that bank. 5. If both banks are idle and CKE is inactive(low level), then self refresh mode. 6. Illegal if tRCD is not met. 7. Illegal if tRAS is not met. 8. Must satisfy bus contention, bus turn around, and/or write recovery requirements. 9. Illegal if tRRD is not met. 10. Illegal for single bank, but legal for other banks in multi-bank devices. 11. Illegal for all banks.
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1HY5DU323222Q
CKE FUNCTION TRUTH TABLE
Current State CKEn1 CKEn /CS /RAS /CAS /WE /ADD Action
H L L SELF REFRESH1 L L L L H L POWER DOWN2 L L L L L H H H ALL BANKS IDLE4 H H H H H L ANY STATE OTHER THAN ABOVE H H L L
X H H H H H L X H H H H H L H L L L L L L L L H L H L
X H L L L L X X H L L L L X X L H L L L L L X X X X X
X X H H H L X X X H H H L X X L X H H H L L X X X X X
X X H H L X X X X H H L X X X L X H H L H L X X X X X
X X H L X X X X X H L X X X X H X H L X X L X X X X X
X X X X X X X X X X X X X X X X X X X X X X X X X X X
INVALID Exit self refresh, enter idle after tSREX Exit self refresh, enter idle after tSREX ILLEGAL ILLEGAL ILLEGAL NOP, continue self refresh INVALID Exit power down, enter idle Exit power down, enter idle ILLEGAL ILLEGAL ILLEGAL NOP, continue power down mode See operation command truth table Enter self refresh Exit power down Exit power down ILLEGAL ILLEGAL ILLEGAL ILLEGAL NOP See operation command truth table ILLEGAL5 INVALID INVALID
Note : When CKE=L, all DQ and DQS must be in Hi-Z state. 1. CKE and /CS must be kept high for a minimum of 200 stable input clocks before issuing any command. 2. All command can be stored after 2 clocks from low to high transition of CKE. 3. Illegal if CK is suspended or stopped during the power down mode. 4. Self refresh can be entered only from the all banks idle state. 5. Disabling CK may cause malfunction of any bank which is in active state.
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1HY5DU323222Q
SIMPLIFIED STATE DIAGRAM
MODE REGISTER SET
MRS
IDLE
SREF SREX
SELF REFRESH
PDEN PDEX
POWER DOWN
POWER DOWN
AREF ACT
AUTO REFRESH
PDEN
BST
BANK ACTIVE
PDEX
READ WRITE READAP
WRITE
READ
PRE(PALL)
WRITE WITH AUTOPRECHARGE
READ READAP WITH AUTOPRECHARGE WRITEAP
READ
WRITEAP
WRITE PRE(PALL) PRE(PALL)
PRECHARGE
POWER-UP
Command Input Automatic Sequence
POWER APPLIED
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1HY5DU323222Q
POWER-UP SEQUENCE AND DEVICE INITIALIZATION
DDR SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than those specified may result in undefined operation. Power must first be applied to VDD, then to VDDQ, and finally to VREF (and to the system VTT). VTT must be applied after VDDQ to avoid device latch-up, which may cause permanent damage to the device. VREF can be applied anytime after VDDQ, but is expected to be nominally coincident with VTT. Except for CKE, inputs are not recognized as valid until after VREF is applied. CKE is an SSTL_2 input, but will detect an LVCMOS LOW level after VDD is applied. Maintaining an LVCMOS LOW level on CKE during power-up is required to guarantee that the DQ and DQS outputs will be in the High-Z state, where they will remain until driven in normal operation (by a read access). After all power supply and reference voltages are stable, and the clock is stable, the DDR SDRAM requires a 200us delay prior to applying an executable command. Once the 200us delay has been satisfied, a DESELECT or NOP command should be applied, and CKE should be brought HIGH. Following the NOP command, a PRECHARGE ALL command should be applied. Next a EXTENDED MODE REGISTER SET command should be issued for the Extended Mode Register, to enable the DLL, then a MODE REGISTER SET command should be issued for the Mode Register, to reset the DLL, and to program the operating parameters. After the DLL reset, tXSRD(DLL locking time) should be satisfied for read command. After the Mode Register set command, a PRECHARGE ALL command should be applied, placing the device in the all banks idle state. Once in the idle state, two AUTO REFRESH cycles must be performed. Additionally, a MODE REGISTER SET command for the Mode Register with the reset DLL bit deactivated low (i.e. to program operating parameters without resetting the DLL) must be performed. Following these cycles, the DDR SDRAM is ready for normal operation. 1. Apply power - VDD, VDDQ, VTT, VREF in the following power up sequencing and attempt to maintain CKE at LVCMOS low state. (All the other input pins may be undefined.) * VDD and VDDQ are driven from a single power converter output. * VTT is limited to 1.44V (reflecting VDDQ(max)/2 + 50mV VREF variation + 40mV VTT variation. * VREF tracks VDDQ/2. * A minimum resistance of 42 Ohms (22 ohm series resistor + 22 ohm parallel resistor - 5% tolerance) limits the input current from the VTT supply into any pin. * If the above criteria cannot be met by the system design, then the following sequencing and voltage relationship must be adhered to during power up. Votage description VDDQ VTT VREF 2. 3. 4. 5. 6. 7. 8. Sequencing After or with VDD After or with VDDQ After or with VDDQ Voltage relationship to avoid latch-up < VDD + 0.3V < VDDQ + 0.3V < VDDQ + 0.3V
Start clock and maintain stable clock for a minimum of 200usec. After stable power and clock, apply NOP condition and take CKE high. Issue Extended Mode Register Set (EMRS) to enable DLL. Issue Mode Register Set (MRS) to reset DLL and set device to idle state with bit A8=High. (An additional 200 cycles(tXSRD) of clock are required for locking DLL) Issue Precharge commands for all banks of the device. Issue 2 or more Auto Refresh commands. Issue a Mode Register Set command to initialize the mode register with bit A8 = Low.
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1HY5DU323222Q
Power-Up Sequence
VDD
VDDQ
tVTD
VTT VREF
/CLK CLK
tIS tIH
CKE
LVCMOS Low Level
CMD
NOP
PRE
EMRS
MRS
NOP
PRE
AREF
MRS
ACT
RD
DM
ADDR
CODE
CODE
CODE
CODE
CODE
A10
CODE
CODE
CODE
CODE
CODE
BA0, BA1
CODE
CODE
CODE
CODE
CODE
DQS
DQ'S
T=200usec tRP
tMRD
tMRD
tRP
tRFC tXSRD*
tMRD
Power UP VDD and CK stable
Precharge All
EMRS Set
MRS Set Reset DLL (with A8=H)
Precharge All
2 or more Auto Refresh
MRS Set (with A8=L)
Non-Read Command
READ
* 200 cycle(tXSRD) of CK are required (for DLL locking) before Read Command
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1HY5DU323222Q
MODE REGISTER SET (MRS)
The mode register is used to store the various operating modes such as /CAS latency, addressing mode, burst length, burst type, test mode, DLL reset. The mode register is program via MRS command. This command is issued by the low signals of /RAS, /CAS, /CS, /WE and BA0. This command can be issued only when all banks are in idle state and CKE must be high at least one cycle before the Mode Register Set Command can be issued. Two cycles are required to write the data in mode register. During the the MRS cycle, any command cannot be issued. Once mode register field is determined, the information will be held until resetted by another MRS command. BA1 0 BA0 0 A9 RFU A8 DR A7 TM A6 A5 CAS Latency A4 A3 BT A2 A1 Burst Length A0
BA0 0 1
MRS Type MRS EMRS
A7 0 1
Test Mode Normal Test
A3 0 1
Burst Type Sequential Interleave
A8 0 1
DLL Reset No Yes A2 0 0 A1 0 0 1 1 0 0 1 1 A0 0 1 0 1 0 1 0 1 Burst Length Sequential Reserved 2 4 8 Reserved Reserved Reserved Reserved Interleave Reserved 2 4 8 Reserved Reserved Reserved Reserved
A6 0 0 0 0 1 1 1 1
A5 0 0 1 1 0 0 1 1
A4 0 1 0 1 0 1 0 1
CAS Latency Reserved Reserved Reserved 3 4 Reserved Reserved Reserved
0 0 1 1 1 1
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1HY5DU323222Q
BURST DEFINITION
Burst Length 2 Starting Address (A2,A1,A0) XX0 XX1 X00 4 X01 X10 X11 000 001 010 8 011 100 101 110 111 Sequential 0, 1 1, 0 0, 1, 2, 3 1, 2, 3, 0 2, 3, 0, 1 3, 0, 1, 2 0, 1, 2, 3, 4, 5, 6, 7 1, 2, 3, 4, 5, 6, 7, 0 2, 3, 4, 5, 6, 7, 0, 1 3, 4, 5, 6, 7, 0, 1, 2 4, 5, 6, 7, 0, 1, 2, 3 5, 6, 7, 0, 1, 2, 3, 4 6, 7, 0, 1, 2, 3, 4, 5 7, 0, 1, 2, 3, 4, 5, 6 Interleave 0, 1 1, 0 0, 1, 2, 3 1, 0, 3, 2 2, 3, 0, 1 3, 2, 1, 0 0, 1, 2, 3, 4, 5, 6, 7 1, 0, 3, 2, 5, 4, 7, 6 2, 3, 0, 1, 6, 7, 4, 5 3, 2, 1, 0, 7, 6, 5, 4 4, 5, 6, 7, 0, 1, 2, 3 5, 4, 7, 6, 1, 0, 3, 2 6, 7, 4, 5, 2, 3, 0, 1 7, 6, 5, 4, 3, 2, 1, 0
BURST LENGTH & TYPE
Read and write accesses to the DDR SDRAM are burst oriented, with the burst length being programmable. The burst length determines the maximum number of column locations that can be accessed for a given Read or Write command. Burst lengths of 2, 4 or 8 locations are available for both the sequential and the interleaved burst types. Reserved states should not be used, as unknown operation or incompatibility with future versions may result. When a Read or Write command is issued, a block of columns equal to the burst length is effectively selected. All accesses for that burst take place within this block, meaning that the burst wraps within the block if a boundary is reached. The block is uniquely selected by A1-Ai when the burst length is set to two, by A2-Ai when the burst length is set to four and by A3-Ai when the burst length is set to eight (where Ai is the most significant column address bit for a given configuration). The remaining (least significant) address bit(s) is (are) used to select the starting location within the block. The programmed burst length applies to both Read and Write bursts. Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the burst type and is selected via bit A3. The ordering of accesses within a burst is determined by the burst length, the burst type and the starting column address, as shown in Burst Definitionon Table
CAS LATENCY
The Read latency or CAS latency is the delay in clock cycles between the registration of a Read command and the
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1HY5DU323222Q
availability of the first burst of output data. The latency can be programmed 3 or 4 clocks. If a Read command is registered at clock edge n and the latency is m clocks, the data is available nominally coincident with clock edge n + m. Reserved states should not be used as unknown operation or incompatibility with future versions may result.
DLL RESET
The DLL must be enabled for normal operation. DLL enable is required during power up initialization, and upon returning to normal operation after having disabled the DLL for the purpose of debug or evaluation. The DLL is automatically disabled when entering self refresh operation and is automatically re-enabled upon exit of self refresh operation. Any time the DLL is enabled, 200 clock cycles must occur to allow time for the internal clock to lock to the externally applied clock before an any command can be issued.
OUTPUT DRIVER IMPEDANCE CONTROL
The HY5DU323222 supports both Half strength driver and Matched impedance driver, intended for lighter load and/or point-to-point environments. Half strength driver is to define about 50% of Full drive strength which is specified to be SSTL_2, Class II, and Matched impedance driver, about 30% of Full drive strength.
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1HY5DU323222Q
EXTENDED MODE REGISTER SET (EMRS)
The Extended Mode Register controls functions beyond those controlled by the Mode Register; these additional functions include DLL enable/disable, output driver strength selection(optional). These functions are controlled via the bits shown below. The Extended Mode Register is programmed via the Mode Register Set command ( BA0=1 and BA1=0) and will retain the stored information until it is programmed again or the device loses power. The Extended Mode Register must be loaded when all banks are idle and no bursts are in progress, and the controller must wait the specified time before initiating any subsequent operation. Violating either of these requirements will result in unspecified operation. BA1 0 BA0 1 A9 A8 RFU* A7 A6 DS A5 A4 RFU* A3 A2 A1 DS A0 DLL
BA0 0 1
MRS Type MRS EMRS A0 0 1 DLL enable Enable Disable
A6 0 0 1 1
A1 0 1 0 1
Output Driver Impedance Control RFU* Half RFU* Mached Impedance (Weak)
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1HY5DU323222Q
ABSOLUTE MAXIMUM RATINGS
Parameter
Ambient Temperature Storage Temperature Voltage on Any Pin relative to VSS Voltage on VDD relative to VSS Voltage on VDDQ relative to VSS Output Short Circuit Current Power Dissipation Soldering Temperature Time
Symbol
TA TSTG VIN, VOUT VDD VDDQ IOS PD TSOLDER
Rating
0 ~ 70 -55 ~ 125 -0.5 ~ 3.6 -0.5 ~ 3.6 -0.5 ~ 3.6 50 1 260 10
o
Unit
oC o
C
V V V mA W C sec
Note : Operation at above absolute maximum rating can adversely affect device reliability
DC OPERATING CONDITIONS
Parameter
Power Supply Voltage Power Supply Voltage Input High Voltage Input Low Voltage Termination Voltage Reference Voltage Input Voltage Level, CK and CK inputs Input Differential Voltage, CK and CK inputs V-I Matching: Pullup to Pulldown Current Ratio Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage
(TA=0 to 70oC, Voltage referenced to VSS = 0V)
Symbol
VDD VDDQ VIH VIL VTT VREF VIN(DC) VID(DC) VI(RATIO) ILI ILO VOH VOL
Min
2.375 2.375 VREF + 0.15 -0.3 VREF - 0.04 0.49*VDDQ -0.3 0.36 0.71 -2 -5 VTT + 0.76 -
Typ.
2.5 2.5 VREF 0.5*VDDQ
Max
2.625 2.625 VDDQ + 0.3 VREF - 0.15 VREF + 0.04 0.51*VDDQ VDDQ+0.3 VDDQ+0.6 1.4 2 5 VTT - 0.76
Unit
V V V V V V V V uA uA V V
Note
1 2 3 4 5 6 IOL = -15.2mA IOL = +15.2mA
Note : 1. VDDQ must not exceed the level of VDD. 2. VIL (min) is acceptable -1.5V AC pulse width with 5ns of duration. 3. VREF is expected to be equal to 0.5*VDDQ of the transmitting device, and to track variations in the dc level of the same. Peak to peak noise on VREF may not exceed 2% of the dc value.
4. VID is the magnitude of the difference between the input level on CK and the input level on /CK. 5. The ratio of the pullup current to the pulldown current is specified for the same temperature and voltage, over the entire temper ature and voltage range, for device drain to source voltages from 0.25V to 1.0V. For a given output, it represents the maximum difference between pullup and pulldown drivers due to process variation. The full variation in the ratio of the maximum to minimum pullup and pulldown current will not exceed 1/7 for device drain to source voltages from 0.1 to 1.0. 6. VIN=0 to VDD, All other pins are not tested under VIN =0V. 2. DOUT is disabled, VOUT=0 to VDD
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1HY5DU323222Q
DC CHARACTERISTICS I
Parameter
Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage (TA=0 to 70oC, Voltage referenced to VSS = 0V)
Symbol
ILI ILO VOH VOL
Min.
-2 -5 VTT + 0.76 -
Max
2 5 VTT - 0.76
Unit
uA uA V V
Note
1 2 IOH = -15.2mA IOL = +15.2mA
Note : 1. VIN = 0 to 3.6V, All other pins are not tested under VIN = 0V. 2. DOUT is disabled, VOUT = 0 to 2.7V
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1HY5DU323222Q
DC CHARACTERISTICS II
(TA=0 to 70oC, Voltage referenced to VSS = 0V)
Speed Parameter Symbol Test Condition 5 6 Unit
Note
Operating Current
IDD1
Burst length=2, One bank active tRC tRC(min), IOL=0mA
210
mA
1
Precharge Standby Current in Power Down Mode
IDD2P
CKE VIL(max), tCK = min
20
mA
Precharge Standby Current in Non Power Down Mode
IDD2N
CKE VIH(min), /CS VIH(min), tCK = min, Input signals are changed one time during 2clks
80
mA
Active Standby Current in Power Down Mode
IDD3P
CKE VIL(max), tCK = min
25
mA
Active Standby Current in Non Power Down Mode
IDD3N
CKE VIH(min), /CS VIH(min), tCK = min, Input signals are changed one time during 2clks tCK tCK(min), IOL= 0mA All banks active tRC tRFC(min), All banks active CKE 0.2V
200
mA
Burst Mode Operating Current
IDD4
350
mA
1
Auto Refresh Current
IDD5
270
mA
1,2
Self Refresh Current
IDD6
3
mA
Note : 1. IDD1, IDD4 and IDD5 depend on output loading and cycle rates. Specified values are measured with the output open. 2. Min. of tRFC (Auto Refresh Row Cycle Time) is shown at AC CHARACTERISTICS.
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1HY5DU323222Q
AC OPERATING CONDITIONS (TA=0 to 70oC, Voltage referenced to VSS = 0V)
Parameter Symbol Min Max Unit Note
Input High (Logic 1) Voltage, DQ, DQS and DM signals Input Low (Logic 0) Voltage, DQ, DQS and DM signals Input Differential Voltage, CK and /CK inputs Input Crossing Point Voltage, CK and /CK inputs
VIH(AC) VIL(AC) VID(AC) VIX(AC)
VREF + 0.45 VREF - 0.45 0.7 0.5*VDDQ-0.2 VDDQ + 0.6 0.5*VDDQ+0.2
V V V V 1 2
Note : 1. VID is the magnitude of the difference between the input level on CK and the input on CK. 2. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the DC level of the same.
AC OPERATING TEST CONDITIONS (TA=0 to 70oC, Voltage referenced to VSS = 0V)
Parameter Value Unit
Reference Voltage Termination Voltage AC Input High Level Voltage (VIH, min) AC Input Low Level Voltage (VIL, max) Input Timing Measurement Reference Level Voltage Output Timing Measurement Reference Level Voltage Input Signal maximum peak swing Input minimum Signal Slew Rate Termination Resistor (RT) Series Resistor (RS) Output Load Capacitance for Access Time Measurement (CL)
VDDQ x 0.5 VDDQ x 0.5 VREF + 0.45 VREF - 0.45 VREF VTT 1.5 1 50 25 30
V V V V V V V V/ns

pF
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1HY5DU323222Q
AC Overshoot/Undershoot Specification for Address and Control Pins
This specification is intended for devices with no clamp protection and is guaranteed by design
Parameter Specification
Maximum peak amplitude allowed for overshoot (See Figure 1): Maximum peak amplitude allowed for undershoot (See Figure 1): The area between the overshoot signal and VDD must be less than or equal to (See Figure 1): The area between the undershoot signal and GND must be less than or equal to (See Figure 1):
1.5V 1.5V 4.5V - ns 4.5V - ns
+5 +4 +3
Max. amplitude=1.5V
Overshoot
Volts +2 (V) +1
0 -1 -2 -3 0
Max. area=4.5V-ns
VDD
Ground
Undershoot
3 4 5 6
1
2
Time(ns)
Overshoot/Undershoot Specification for Data, Strobe, and Mask Pins
Parameter
Figure 1: Address and Control AC Overshoot and Undershoot Definitio
Specification
Maximum peak amplitude allowed for overshoot (See Figure 2): Maximum peak amplitude allowed for undershoot (See Figure 2): The area between the overshoot signal and VDD must be less than or equal to (See Figure 2): The area between the undershoot signal and GND must be less than or equal to (See Figure 2):
1.2V 1.2V 2.4V - ns 2.4V - ns
+5 +4 +3
Max. amplitude=1.2V
Overshoot
Volts +2 (V) +1
0 -1 -2 -3 0
Max. area=2.4V-ns
VDD
Ground
Undershoot
3 4 5 6
1
2
Time(ns)
Figure 2: DQ/DM/DQS AC Overshoot and Undershoot Definition
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1HY5DU323222Q
AC CHARACTERISTICS (AC operating conditions unless otherwise noted)
Parameter Symbol 5 Min Max Min 6 Max
Unit Note
Row Cycle Time Auto Refresh Row Cycle Time Row Active Time Row Address to Column Address Delay for Read Row Address to Column Address Delay for Write Row Active to Row Active Delay Column Address to Column Address Delay Row Precharge Time Last Data-In to Precharge Delay Time (Write Recovery Time : tWR) Last Data-In to Read Command Auto Precharge Write Recovery + Precharge Time System Clock Cycle Time Clock High Level Width Clock Low Level Width Data-Out edge to Clock edge Skew DQS-Out edge to Clock edge Skew DQS-Out edge to Data-Out edge Skew Data-Out hold time from DQS Clock Half Period Data Hold Skew Factor Input Setup Time Input Hold Time Write DQS High Level Width Write DQS Low Level Width Clock to First Rising edge of DQS-In CL = 3.0
tRC tRFC tRAS tRCDRD tRCDWR tRRD tCCD tRP tDPL tDRL tDAL tCK tCH tCL tAC tDQSCK tDQSQ tQH tHP tQHS tIS tIH tDQSH tDQSL tDQSS
60 70 40 4 2 2 1 4 2 2 6 5 0.45 0.45 -0.9 -0.7 tHPmin -tQHS tCH/L min 1.0 1.0 0.4 0.4 0.75
120K 10 0.55 0.55 0.9 0.7 0.4 0.75 0.6 0.6 1.25
66 72 45 4 3 2 1 4 2 2 6 6 0.45 0.45 -0.9 -0.7 tHPmin -tQHS tCH/L min 1.0 1.0 0.4 0.4 0.75
120K 10 0.55 0.55 0.9 0.7 0.4 0.75 0.6 0.6 1.25
ns ns ns CK CK CK CK CK CK CK CK ns CK CK CK ns ns ns ns ns ns ns ns CK CK 1,6 1,5 6 2 2
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1HY5DU323222Q
5 Min Max Min 6 Max
Unit Note
Parameter
Symbol
Data-In Setup Time to DQS-In (DQ & DM) Data-In Hold Time to DQS-In (DQ & DM) Read DQS Preamble Time Read DQS Postamble Time Write DQS Preamble Setup Time Write DQS Preamble Hold Time Write DQS Postamble Time Mode Register Set Delay Exit Self Refresh to Any Execute Command Average Periodic Refresh Interval
Note :
tDS tDH tRPRE tRPST tWPRES tWPREH tWPST tMRD tXSC tREFI
0.5 0.5 0.9 0.4 0 1.5 0.4 2 200 -
1.1 0.6 0.6 7.8
0.5 0.5 0.9 0.4 0 1.5 0.4 2 200 -
1.1 0.6 0.6 7.8
CK ns ns CK CK ns ns CK CK CK
3 3
4
1. This calculation accounts for tDQSQ(max), the pulse width distortion of on-chip circuit and jitter. 2. Data sampled at the rising edges of the clock : A0~A9, BA0~BA1, CKE, /CS, /RAS, /CAS, /WE. 3. Data latched at both rising and falling edges of Data Strobes(DQS) : DQ, DM(0~3). 4. Minimum of 200 cycles of stable input clocks after Self Refresh Exit command, where CKE is held high, is required to complete Self Refresh Exit and lock the internal DLL circuit of DDR SDRAM. 5. Min (tCL, tCH) refers to the smaller of the actual clock low time and the actual clock high time as provided to the device (i.e. this value can be greater than the minimum specification limits for tCL and tCH). 6. tHP = minimum half clock period for any given cycle and is defined by clock high or clock low (tCH, tCL). tQHS consists of tDQSQmax, the pulse width distortion of on-chip clock circuits, data pin to pin skew and output pattern effects, and p-channel to n-channel variation of the output drivers. 7. DQS, DM and DQ input slew rate is specified to prevent double clocking of data and preserve setup and hold times. Signal transitions through the DC region must be monotonic.
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1HY5DU323222Q
CAPACITANCE (TA=25oC, f=1MHz )
Parameter Pin Symbol Min Max Unit
Input Clock Capacitance Input Capacitance Input / Output Capacitanc
CK, /CK All other input-only pins DQ, DQS, DM
CCK CIN CIO
1.7 1.7 3.7
2.7 2.7 4.7
pF pF pF
Note : 1. VDD = min. to max., VDDQ = 2.3V to 2.7V, VODC = VDDQ/2, VOpeak-to-peak = 0.2V 2. Pins not under test are tied to GND. 3. These values are guaranteed by design and are tested on a sample basis only.
OUTPUT LOAD CIRCUIT
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1HY5DU323222Q
PACKAGE INFORMATION
20mm x 14mm 100pin Low Quad Flat Package
22.10(0.870) 21.90(0.862)
Unit:mm(inch)
20.10(0.791) 19.90(0.783)
1.60(0.063) 1.45(0.057)
14.10(0.555) 13.90(0.547)
16.10(0.634) 15.90(0.626)
Detail A
Gauge Line
Base Plane
0.15(0.006) 0.05(0.002)
0.20(0.008) 0.09(0.004)
0.65 (0.026)TYP
Seating Plane
0.38(0.015) 0.22(0.009)
0~7 Deg
0.080 (0.003)
0.75(0.029) 0.50(0.020)
Detail A
0.66(0.026) 0.45(0.018)
1.00(0.0394)REF
All dimension in mm (inches). Notation is
MAX or typical. MIN
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